LT3760EFE#PBF【PDF 30/32 页】IC LED DVR WHT/CLR BCKLT 28TSSOP

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LT3760

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

FE Package

28-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation EB

4.75

(.187)

9.60 – 9.80*

(.378 – .386)

4.75

(.187)

28 2726 25 24 23 22 21 20 19 18 17 16 15

6.60 ± 0.10

4.50 ± 0.10

SEE NOTE 4

2.74

(.108)

0.45 ± 0.05

EXPOSED

PAD HEAT SINK

ON BOTTOM OF

PACKAGE

2.74

(.108)

6.40

(.252)

BSC

1.05 ± 0.10

0.65 BSC

RECOMMENDED SOLDER PAD LAYOUT

1 2 3 4 5 6 7 8 9 10 11 12 13 14

4.30 – 4.50*

(.169 – .177)

0.25

REF

0 ° – 8 °

1.20

(.047)

MAX

0.09 – 0.20 0.50 – 0.75

(.0035 – .0079) (.020 – .030)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN MILLIMETERS

(INCHES)

3. DRAWING NOT TO SCALE

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

0.05 – 0.15

(.002 – .006)

FE28 (EB) TSSOP 0204

3760fc

30

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